MEMS Pumi pumehana

1. He aha ka mea ʻike kaomi MEMS

ʻO ka sensor Pressure kahi mea maʻamau i hoʻohana ʻia i ka hana ʻoihana, maʻamau i haku ʻia me nā mea koʻikoʻi kaomi (elastic sensitive elements, displacement sensitive elements) a me nā ʻāpana hana hōʻailona. hiki iā ia ke manaʻo i ka hōʻailona kaomi, a hiki ke hoʻololi i ka hōʻailona kaomi i kahi hōʻailona uila puka i loaʻa e like me kekahi mau kānāwai. No ke ana pololei, ka mana a me ka nānā ʻana, me ka pololei kiʻekiʻe, ka pale ʻana i ka corrosion a me ka hana paʻa, kūpono no nā ʻano ʻano ʻino.

ʻO nā mea kani puʻe MEMS, ka inoa piha: Microelectro mechanical system pressure sensor, hoʻohui i ka ʻenehana microelectronics ʻokiʻoki a me ka ʻenehana micromachining precision. Ma o ka hui pū ʻana o ka micro-mechanical structure a me ka uila uila, ua hoʻohana ʻia ka chip i hana ʻia i nā mea semiconductor kuʻuna e like me ka monocrystalline silicon wafers ma ke ʻano nui e ana i ke kaomi ma ka ʻike ʻana i ka deformation kino a i ʻole ka hōʻiliʻili kālā. A laila hoʻololi ʻia i mau hōʻailona uila no ka hoʻoponopono ʻana e ʻike i ka nānā ʻana i ka nānā ʻana a me ka hoʻololi pololei ʻana i nā loli kaomi. Aia kona waiwai nui i kāna hoʻolālā miniaturization, ka mea e hāʻawi i ka MEMS pressure sensors i ʻoi aku ka maikaʻi ma ke ʻano o ka pololei, ka nui, ka wikiwiki o ka pane a me ka hoʻohana ʻana i ka ikehu.

2. Nā hiʻohiʻona o ka mīkini paʻi MEMS

Hiki ke hoʻolālā a hana ʻia nā mīkini paʻi MEMS me ka hoʻohana ʻana i nā ʻenehana e like me nā kaapuni i hoʻohui ʻia, e hiki ai i ka hana kiʻekiʻe kiʻekiʻe, haʻahaʻa haʻahaʻa. Wehe kēia i ka puka no ka hoʻohana nui ʻana i nā mea ʻike MEMS no nā mea kūʻai uila a me nā huahana hoʻokele kaʻina hana ʻoihana, e hana maʻalahi i ka mana kaomi, mea hoʻohana, a naʻauao.

Hoʻokumu ʻia nā ʻenekini kaomi kuʻuna ma luna o ka deformation o nā elastomers metala ma lalo o ka ikaika, e hoʻohuli ana i ka deformation elastic elastic i ka hoʻopuka uila. No laila,ʻaʻole hiki iā lākou ke liʻiliʻi e like me nā kaapuni i hoʻohuiʻia e like me nā mīkini paʻi MEMS, aʻoi aku ka kiʻekiʻe o kā lākou kumukūʻai ma mua o nā meaʻike puʻupuʻu MEMS. Ke hoʻohālikelike ʻia me nā ʻenekini mīkini kuʻuna, ʻoi aku ka liʻiliʻi o nā mea ʻike kaomi MEMS, me ka nui ʻaʻole iʻoi aku ma mua o hoʻokahi kenimika. Ke hoʻohālikelike ʻia me ka ʻenehana hana mīkini kuʻuna, ʻoi aku ka maikaʻi o kā lākou kumukūʻai.

3. Ka hoʻohanaʻana i ka mīkini paʻi MEMS

ʻO ka ʻoihana kaʻa:

ʻO ke kahua kaʻa kaʻa kekahi o nā noi haʻahaʻa nui o nā sensor MEMS. Ma ke kahua kaʻa kaʻa, hoʻohana nui ʻia nā mīkini kaomi MEMS i nā ʻōnaehana palekana (e like me ka nānā ʻana i ke kaomi ʻana o nā ʻōnaehana braking, ka hoʻomalu ʻana i nā airbags, a me ka pale ʻana i ka hoʻomake ʻana), ka hoʻokuʻu ʻana (ka hoʻoheheʻe ʻana i ke kinoea hoʻokele a me ka nānā ʻana) , a me nā ʻōnaehana hoʻokuʻu ma muli o kā lākou miniaturization, kiʻekiʻe kiʻekiʻe, a me ka hilinaʻi. Loaʻa pinepine nā kaʻa kiʻekiʻe i nā haneli he nui, me ka 30-50 MEMS sensor, a ma kahi o 10 he mau mea ʻike kaomi MEMS. Hiki i kēia mau mea ʻike ke hāʻawi i ka ʻikepili koʻikoʻi e kōkua i nā mea hana kaʻa e hoʻomaikaʻi i ka hana ʻenekini, hoʻomaikaʻi i ka pono wahie, a hoʻonui i ka palekana kaʻa.

Mea uila uila:

Me ka hoʻomohala ʻana o nā noi e like me ka hoʻokele 3D, ka nānā ʻana i ka neʻe, a me ka nānā ʻana i ke olakino, ke hoʻohana ʻia nei ka hoʻohana ʻana i nā mea ʻike kaomi MEMS i nā mea uila uila. Hiki ke hoʻohana ʻia nā mea ʻike kaomi i nā mea like me nā smartphones, papa, a me nā wati akamai no nā hana e like me barometers, altimeters, a me ka hoʻokele i loko. Hiki i nā mea ʻike paʻi i nā mea hoʻohana akamai ke nānā i ka hoʻoikaika kino a me nā hōʻailona olakino e like me ka puʻuwai a me ka hoʻoikaika kino, e hāʻawi ana i ka ʻikepili pololei. Eia kekahi, hoʻohana nui ʻia nā mea hoʻonaninani MEMS i nā kahua e like me nā drones a me nā hiʻohiʻona mokulele, e hāʻawi ana i ka ʻike kiʻekiʻe a me ka hui pū ʻana me nā ʻōnaehana hoʻokele e hoʻokō i ka mana holo pololei.

ʻoihana lapaʻau:

I ka ʻoihana lapaʻau, hoʻohana nui ʻia nā mīkini paʻi MEMS i nā ʻano lāʻau lapaʻau a me nā ʻōnaehana ʻike. Hiki ke hoʻohana ʻia no ka ʻike ʻana i ke koko, ka mālama ʻana i nā ventilator a me nā respirator, ka nānā ʻana i ke kaomi kūloko, a me nā ʻōnaehana lawe lāʻau. Hāʻawi kēia mau mea ʻike i nā ana kaomi pololei e kōkua i nā limahana lapaʻau i ka maʻi maʻi a me ka mālama ʻana.

ʻOihana ʻenehana:

Ma ke kahua o ka ʻenehana ʻoihana, hoʻohana ʻia nā mea ʻike kaomi MEMS e nānā a mālama i nā kaʻina hana ʻoihana like ʻole, a hoʻohana nui ʻia lākou i nā ʻōnaehana wai a me ke kinoea, ka nānā ʻana i ka pae, ka mana kaomi, a me ke ana kahe. ʻO ka pololei kiʻekiʻe a me ka hilinaʻi o kēia mau mea ʻike pono e hōʻoia i ka paʻa a me ka palekana o nā kaʻina hana ʻoihana.

Aerospace:

Hiki ke hoʻohana ʻia nā mea ʻike kaomi MEMS no ka hoʻāʻo ʻana i ka hana aerodynamic o nā mokulele a me nā pōhaku, ka nānā ʻana i ke kaomi kiʻekiʻe, ka hōʻiliʻili ʻikepili meteorological, a me ka mālama ʻana i ka ea o nā mokulele a me nā lako o ka lewa. ʻO kāna miniaturization a me nā hiʻohiʻona māmā e kūpono ia no ka ʻoihana aerospace e hoʻokō i nā koi kaiapuni koi.

4. Ka nui o ka mākeke o ka mīkini paʻi MEMS

Ke alakaʻi ʻia e ka hoʻohana ākea ʻana i nā ʻoihana like ʻole, ke ulu nui nei ka nui o ka mākeke o MEMS pressure sensor. Ua wānana ʻo Yole e piʻi ka nui o ka mākeke sensor sensor MEMS honua mai US $ 1.684 biliona a i US $ 2.215 biliona ma 2019-2026, me ka awelika o ka ulu ʻana o ka hui ʻana ma kahi o 5%; Ua hoʻonui ʻia nā moku mai 1.485 biliona ʻāpana a i 2.183 biliona mau ʻāpana, me ka awelika o ka ulu ʻana o ka hui makahiki he 4.9%. Me ka piʻi nui ʻana o ka noi no ka hoʻonā ʻana i ka ʻike ʻana i ke kaomi pono a me ka hilinaʻi, ua manaʻo ʻia ka mākeke sensor pressure MEMS e hoʻonui nui ʻia i nā makahiki e hiki mai ana, e hāʻawi ana i nā manawa he nui no nā mea hana a me nā mea hoʻolako i kēia kahua.