Semiconductor Packaging Process Bonding Wedge

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ʻO ka splitter, ka mea i ʻike ʻia ʻo ka nozzle kila a me ka nila vertical, he mea koʻikoʻi ia o ka hoʻopaʻa ʻana i ke alakaʻi i ke kaʻina hana semiconductor packaging, ʻo ia hoʻi ka hoʻomaʻemaʻe ʻana, ka sintering chip, ka hoʻopaʻa alakaʻi, ka pāpale sila a me nā kaʻina hana ʻē aʻe. ʻO ka hoʻopaʻa alakaʻi he ʻenehana ia e ʻike ai i ka pilina uila a me ka launa ʻike ma waena o ka chip a me ka substrate. Hoʻokomo ʻia ka splinter ma ka mīkini hoʻopaʻa alakaʻi. Ma lalo o ka hana o ka ikehu o waho (ultrasonic, kaomi, wela), ma o ka plastic deformation o ka metala a me ka paʻa o ka māhele diffusion o nā ʻātoma, ke uea alakaʻi (uwea gula, kaula gula, uea alumini, kaula alumini, uea keleawe, kaula keleawe) a ua hoʻokumu ʻia ka pā paʻa. No ka hoʻokō ʻana i ka pilina ma waena o ka chip a me ke kaapuni.