Semiconductor Packaging Process Bonding Wedge

Kufotokozera

The splitter, yomwe imadziwikanso kuti nozzle yachitsulo ndi singano yowongoka, ndi gawo lofunikira pakumangirira kwa lead mu semiconductor ma CD process, yomwe nthawi zambiri imaphatikizapo kuyeretsa, kuyika chip sintering, kulumikiza kutsogolo, kapu yosindikiza ndi njira zina. Kulumikizana motsogola ndiukadaulo wozindikira kulumikizana kwamagetsi ndi kulumikizana kwa chidziwitso pakati pa chip ndi gawo lapansi. The splinter imayikidwa pamakina olumikizirana otsogolera. Pansi pa mphamvu ya kunja (akupanga, kuthamanga, kutentha), kupyolera mu mapindikidwe apulasitiki achitsulo ndi kufalikira kwa gawo lolimba la maatomu, waya wotsogolera (waya wagolide, chingwe cha golide, waya wa aluminiyamu, waya wa aluminiyamu, waya wamkuwa, chingwe chamkuwa) ndipo cholumikizira chimapangidwa. Kukwaniritsa kulumikizana pakati pa chip ndi dera.