Bonding Wedge

Semiconductor Packaging Process Bonding Wedge

Tlhaloso

The splitter, eo hape e tsejoang e le nozzle ea tšepe le nale e emeng, ke karolo ea bohlokoa ea tlamahano ea loto ts'ebetsong ea semiconductor ea ho paka, eo ka kakaretso e kenyelletsang ho hloekisa, sesebelisoa sa chip sintering, lead bonding, cap e tiisang le lits'ebetso tse ling. Lead bonding ke theknoloji ea ho lemoha khokahano ea motlakase le khokahanyo ea tlhahisoleseling lipakeng tsa chip le substrate. Sekhahla se kentsoe mochining oa ho kopanya o etellang pele. Tlas'a ketso ea matla a kantle (ultrasonic, khatello, mocheso), ka ho fetoha ha tšepe ea polasetiki le phallo e tiileng ea liathomo, terata e etellang pele (terata ea khauta, khoele ea khauta, terata ea aluminium, khoele ea aluminium, terata ea koporo, khoele ea koporo) 'me letlapa le tlamang le thehoa. Ho fihlella khokahano lipakeng tsa chip le potoloho.

Iteanye le rona

lintlha tsa sehlahisoa

tlhaloso2

Mofuta

Lead bonding ke e 'ngoe ea lits'ebetso tsa indasteri ea liphutheloana tse kopaneng tsa semiconductor, ho latela litlhoko tse fapaneng tsa mekhoa ea tjheseletsa, e arotsoe ka bolo e tlamahanang le bonding, wedge bonding e na le bokhoni bo fokolang ba ts'ebetso ea sebaka, e fokotsa ho sotha ha lets'oao lipakeng tsa maqhubu a phahameng e le hore ho tsitsa ha lets'oao ho molemo, ha ho loketse bakeng sa ho cheselletsa sehlahisoa se nang le matla a phahameng sesebelisoa se hlokahalang se bitsoa wedge welding thipa. Thipa ea welding e arotsoe ka thipa ea welding ea khauta, thipa ea welding ea khauta, thipa ea wire wedge ea aluminium.

Lisebelisoa

1. Lefapheng la sechaba, ho kopanya li-lead ho sebelisoa haholo-holo ka chip, memori, memori ea flash, sensor, lisebelisoa tsa elektronike tsa bareki, lisebelisoa tsa elektronike tsa likoloi, lisebelisoa tsa matla le liindasteri tse ling.

2. Sebakeng sa sesole, ho kopanya ka pele ho sebelisoa haholo-holo ho li-chips tsa RF, li-filters, motho ea batlang limisaele, libetsa le lisebelisoa, tsamaiso ea lisebelisoa tsa lisebelisoa tsa elektroniki, lisebelisoa tsa radar tsa sebaka sa marang-rang tsa T / R, lisebelisoa tsa elektronike tsa sesole, lifofane, lifofane le liindasteri tsa puisano.

Khetho ea lintho tse bonahalang

1.Tšepe ea Alloy T: E loketse ho tlamahanngoa le ho kheloha ho itseng kapa li-substrates tse thata.

2.Titanium carbide material M: boima bo phahameng, ts'ebetso e matla ea ho sebetsa, khatello e tlaase (ho kgothaletswa ho qala ho tloha 7g ho eketsa).

3.Tungsten tšepe H :: boima bo phahameng, ts'ebetso e matla ea ho sebetsa, ho lokisa mekhahlelo e haufi le United States dewey1.

MOQHOKOMELO

WEEDGE Sebopeho sa Arbor

WEEDES letoto

MAQEKO A MONYANE

E loketse ho kopanya terata ea khauta, terata ea aluminium le lithapo tse ling ka har'a 75um.

WEDGES tafole ea boholo

TS	H aperture	BL Bonding bolelele	T Bolelele ba hlooho ea sesebelisoa	W Bophara ba hlooho ea Tool	Wiredia.Mohala oa terata
unit	ngoe	ngoe	ngoe	ngoe	ngoe
1210	30	25	300	64	10-15um
1510	38	25	343	64	13-18um
1515	38	38	356	64
1520	38	51	368	64
2015	51	38	368	102	18-25um
2020	51	51	368	102
2025	51	64	381	102
2525	64	64	406	102	33um
3025	76	64	432	127	38um
3050	76	127	559	152	51 um
3550	89	127	559	152	51 um
Haeba ho hlokahala lintlha tse ling. O ka sheba thekiso ea rona

LIKHOPO TSA KHOPO

E loketse ho kopanya terata ea aluminium le lithapo tse ling tse ka holimo ho 75um.

WEDGES tafole ea boholo

TS	H aperture	BL Bonding bolelele	T Bolelele ba hlooho ea sesebelisoa	W Bophara ba hlooho ea Tool	Wiredia.Mohala oa terata
unit	ngoe	ngoe	ngoe	ngoe	ngoe
4560	114	152	787	191	76
6008	152	203	864	254	102
7510	191	254	1041	318	127
0912	229	305	1245	381	152
01014	267	356	1372	445	178
01215	305	381	1422	508	203
01518	381	457	1626	635	254
1820	457	508	2032	762	305
2122	533	559	2083	889	356
2424	610	610	2362	1016	406
.. Ka kopo ikopanye le lefapha la rona la thekiso bakeng sa boholo bo eketsehileng

LEKHOPO LEKHOETSA

E loketse ho kopanya tepi ea alloy, tepi ea aluminium le terata e meng.

WEDGES tafole ea boholo

Bophara ba lente				Ribone e teteaneng
unit (u m)		12.7m		25.4um
50um		A1		B1
75um		A2		B2
100um		A3		B3
125um		A4		B4
150um		A5		B5
200um		A6		B6
250um		A7		B7
300um		A8		B8
.. Ka kopo ikopanye le lefapha la rona la thekiso bakeng sa boholo bo eketsehileng
TS+BL	FR Leoto le etellang pele	BR Leoto la ka morao la tataiso	TW bophara ba lesoba	TW Hole bophahamo	T Bolelele ba hlooho ea sesebelisoa
A120	25um	8um	50um	75um	126um
A220	25um	8um	65um	75um	126um
B325	25um	8um	65um	75um	190um
B330	25um	8um	90um	176um	190um
B350	25um	8um	100um	340um	380um
... Lisaese tsohle ke tsa litšupiso feela, lintlha tse ling li ka ikopanya le thekiso ea rona

WEDGE Ho iketsetsa motho ka mong

Tse latelang li bonts'itse maemo a fapaneng a mathata a ka bang teng nakong ea bonding le tharollo ea bona.

Bonding Wedge

Semiconductor Packaging Process Bonding Wedge

Mofuta

Lisebelisoa

Khetho ea lintho tse bonahalang

MOQHOKOMELO

WEEDGE Sebopeho sa Arbor

WEEDES letoto

MAQEKO A MONYANE

LIKHOPO TSA KHOPO

LEKHOPO LEKHOETSA

WEDGE Ho iketsetsa motho ka mong

Leave Your Message