Wire Bonding - A Comprehensive Guide | Wikipedia

Chengdu Sandao Technology Co., Ltd. specializes in the production of wire bonding equipment, which is an essential technology in the semiconductor and microelectronics industries. Wire bonding is a method of making interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication, Our company offers a range of wire bonding machines, including wedge bonders and ball bonders, which are used to create these interconnections. These machines are designed to provide precise and reliable bonding, ensuring the highest quality and efficiency in semiconductor manufacturing processes, The wire bonding equipment produced by Chengdu Sandao Technology Co., Ltd. incorporates the latest technological advancements, offering high-speed and highly accurate bonding capabilities. Our machines are also equipped with advanced features to ensure safe and precise bonding processes, meeting the demanding requirements of modern semiconductor manufacturing, With a commitment to innovation and quality, Chengdu Sandao Technology Co., Ltd. is dedicated to providing cutting-edge wire bonding solutions to meet the evolving needs of the semiconductor industry