Bonding Wedge

Semiconductor Packaging Inkqubo Bonding Wedge

Inkcazo

I-splitter, eyaziwa ngokuba yi-nozzle yensimbi kunye nenaliti ethe nkqo, iyinxalenye ebalulekileyo yokubambisana okukhokelayo kwinkqubo yokupakisha ye-semiconductor, ebandakanya ngokubanzi ukucocwa, ukucoca i-chip sintering, i-lead bonding, i-cap yokutywina kunye nezinye iinkqubo. Ikhonkco elikhokelayo bubuchwepheshe bokuqonda uqhagamshelo lombane kunye nonxibelelwano lolwazi phakathi kwetshiphu kunye ne-substrate. I-splinter ifakwe kumatshini okhokelayo wokudibanisa. Ngaphantsi kwesenzo samandla angaphandle (i-ultrasonic, uxinzelelo, ubushushu), ngokusebenzisa ukuguqulwa kweplastiki yesinyithi kunye nesigaba esiqinileyo sokusasazwa kwe-athomu, ucingo olukhokelayo (ucingo lwegolide, umcu wegolide, ucingo lwe-aluminium, umcu we-aluminium, ucingo lobhedu, umcu wobhedu) kwaye iphedi yokudibanisa yenziwe. Ukufezekisa ukudibanisa phakathi kwe-chip kunye nesekethe.

Qhagamshelana nathi

iinkcukacha zemveliso

inkcazelo2

Uhlobo

Ukudityaniswa okukhokelayo yenye yeenkqubo kwishishini lokupakishwa kwesekethe edibeneyo ye-semiconductor, ngokweemfuno ezahlukeneyo zeendlela zokuwelda, yahlulwe yaba yibhondi yebhola kunye ne-wedge bonding, i-wedge bonding inesakhono sokusebenza esincinci, ukunciphisa ukuphazamiseka komqondiso phakathi kwe-frequency ephezulu ukuze ukuhambelana komqondiso kungcono, ngelixa kufanelekile ukuwelda imveliso yamandla aphezulu isixhobo esifunekayo se-welding sibizwa ngokuba yi-wedge welding knife. Wedge welding imela yahlulwe ngokwegolide wire wedge welding imela, igolide ibhanti wedge welding imela, aluminiyam wire wedge welding imela.

Usetyenziso

1. Kwintsimi yoluntu, i-lead bonding isetyenziswa kakhulu kwi-chip, imemori, imemori ye-flash, inzwa, i-electronics yabathengi, i-automotive electronics, izixhobo zamandla kunye namanye amashishini.

2. Kwicandelo lomkhosi, ikhonkco elikhokelayo lisetyenziswa ikakhulu kwiitshiphusi zeRF, izihluzi, umntu ofuna imijukujelwa, izixhobo kunye nezixhobo, inkqubo yokumelana nolwazi lwe-elektroniki, amacandelo e-radar enezigaba ze-radar ye-T/R, izixhobo ze-elektroniki zasemkhosini, i-aerospace, i-aviation kunye nemizi-mveliso yonxibelelwano.

Ukukhetha izinto eziphathekayo

I-1.Intsimbi ye-Alloy T: Ifanelekile ukudibanisa kunye nokunye ukuphambuka okanye i-substrates enzima.

I-2.I-Titanium carbide impahla M: ubunzima obuphezulu, ukuqhuba umsebenzi oqinileyo, uxinzelelo oluphantsi (kucetyiswa ukuba uqale ukusuka kwi-7g ukunyuka).

I-3.Tungsten steel H :: ubunzima obuphezulu, ukuqhuba umsebenzi oqinileyo, ukulungelelanisa iiparamitha ezikufutshane ne-United States dewey1.

WEDGE groove

IWEDGE Isakhiwo somthi

WEDGES series

IMICWANO OMNCINCI OMNCINANE

Ilungele ukubopha ucingo lwegolide, ucingo lwe-aluminiyam kunye nezinye iingcingo ngaphakathi kwe-75um.

WEDGES itafile yobungakanani

TS	H ukuvuleka	BL Bonding ubude	T Ubude bentloko yesixhobo	W Ububanzi bentloko yesixhobo	I-Wiredia.Idamitha yocingo
iyunithi	Nye	Nye	Nye	Nye	Nye
1210	30	25	300	64	10-15um
1510	38	25	343	64	13-18um
1515	38	38	356	64
1520	38	51	368	64
2015	51	38	368	102	18-25um
2020	51	51	368	102
2025	51	64	381	102
2525	64	64	406	102	33um
3025	76	64	432	127	38um
3050	76	127	559	152	51 um
3550	89	127	559	152	51 um
Ukuba ezinye iinkcukacha ziyafuneka. Ungabonisana neentengiso zethu

AMAQINISO OMKHULU

Ilungele ukubopha ucingo lwe-aluminiyam kunye nezinye iingcingo ezingaphezu kwe-75um.

WEDGES itafile yobungakanani

TS	H ukuvuleka	BL Bonding ubude	T Ubude bentloko yesixhobo	W Ububanzi bentloko yesixhobo	I-Wiredia.Idamitha yocingo
iyunithi	Nye	Nye	Nye	Nye	Nye
4560	114	152	787	191	76
6008	152	203	864	254	102
7510	191	254	1041	318	127
0912	229	305	1245	381	152
01014	267	356	1372	445	178
01215	305	381	1422	508	203
01518	381	457	1626	635	254
1820	457	508	2032	762	305
2122	533	559	2083	889	356
2424	610	610	2362	1016	406
.. Nceda uqhagamshelane nesebe lethu lokuthengisa ubungakanani obukhulu

IRIBHONI WEDGE

Ilungele ukubopha i-alloy tape, i-aluminium tape kunye nolunye ucingo.

WEDGES itafile yobungakanani

Ububanzi beRibhoni				Iribhoni engqindilili
iyunithi (u m)		12.7um		25.4um
50um		A1		B1
75um		A2		B2
100um		A3		B3
125um		A4		B4
150um		A5		B5
200um		A6		B6
250um		A7		B7
300um		A8		B8
.. Nceda uqhagamshelane nesebe lethu lokuthengisa ubungakanani obukhulu
TS+BL	FR Unyawo olukhokelayo	BR Unyawo lwesikhokelo ngasemva	TW ububanzi bomngxuma	TW umngxuma ukuphakama	T Ubude bentloko yesixhobo
A120	25um	8um	50um	75um	126um
A220	25um	8um	65um	75um	126um
B325	25um	8um	65um	75um	190um
B330	25um	8um	90um	176um	190um
B350	25um	8um	100um	340um	380um
... Zonke iisayizi zereferensi kuphela, iinkcukacha ezingaphezulu zinokuqhagamshelana neentengiso zethu

I-WEDGE Ukwenziwa ngokwezifiso

Oku kulandelayo kubonise iimeko ezahlukeneyo zengxaki ezinokuthi zenzeke ngexesha lokudibanisa kunye nezisombululo zabo.

Bonding Wedge

Semiconductor Packaging Inkqubo Bonding Wedge

Uhlobo

Usetyenziso

Ukukhetha izinto eziphathekayo

WEDGE groove

IWEDGE Isakhiwo somthi

WEDGES series

IMICWANO OMNCINCI OMNCINANE

AMAQINISO OMKHULU

IRIBHONI WEDGE

I-WEDGE Ukwenziwa ngokwezifiso

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