I-Bonding Wedge

I-Semiconductor Packaging Process Bonding Wedge

Incazelo

I-splitter, eyaziwa nangokuthi i-nozzle yensimbi kanye nenaliti eqondile, iyingxenye ebalulekile yesibopho somthofu enqubweni yokupakisha ye-semiconductor, ngokuvamile ehlanganisa ukuhlanza, ukucwiliswa kwe-chip sintering, i-lead bonding, ikepisi lokuvala nezinye izinqubo. Isibopho somthofu ubuchwepheshe bokubona ukuxhumana kukagesi kanye nokuxhumana kolwazi phakathi kwe-chip ne-substrate. I-splinter ifakwe emshinini wokubopha oholayo. Ngaphansi kwesenzo samandla angaphandle (i-ultrasonic, ingcindezi, ukushisa), ngokusebenzisa ukuguqulwa kwepulasitiki kwensimbi kanye nokusabalalisa kwesigaba esiqinile sama-athomu, intambo eholayo (intambo yegolide, umucu wegolide, ucingo lwe-aluminium, i-aluminium strip, ucingo lwethusi, umugqa wethusi) futhi iphedi yokubopha iyakhiwa. Ukufinyelela ukuxhumana phakathi kwe-chip nesekethe.

Xhumana nathi

imininingwane yomkhiqizo

incazelo2

Uhlobo

Ukubopha okuholayo kungenye yezinqubo embonini yokupakisha yesekethe edidiyelwe ye-semiconductor, ngokwezidingo ezihlukene zezindlela zokushisela, ihlukaniswe yaba yi-ball bonding kanye ne-wedge bonding, i-wedge bonding inekhono lokusebenzisa isikhala esincane, ukunciphisa ukuhlanekezela kwesignali phakathi kwemvamisa ephezulu ukuze ukungaguquguquki kwesignali kungcono, kuyilapho kulungele ukushisela umkhiqizo wamandla aphezulu ithuluzi lokushisela elidingekayo libizwa ngokuthi ummese we-welding welding. Ummese wokushisela we-Wedge uhlukaniswe waba ummese wokushisela we-wedge wegolide, ummese wokushisela webhande legolide, ummese we-aluminium wedge welding.

Izinhlelo zokusebenza

1. Emkhakheni womphakathi, i-lead bonding isetshenziswa ikakhulukazi ku-chip, inkumbulo, inkumbulo ye-flash, inzwa, i-electronics yabathengi, i-automotive electronics, amadivaysi kagesi nezinye izimboni.

2. Emkhakheni wezempi, i-lead bonding isetshenziswa kakhulu kuma-RF chips, izihlungi, abafuna imicibisholo, izikhali namathuluzi, uhlelo lokulwa nolwazi lwe-elekthronikhi, izingxenye ze-radar yezigaba ze-T/R ze-radar, i-electronics yezempi, i-aerospace, izimboni zezindiza nezokuxhumana.

Ukukhetha okubalulekile

I-1.Insimbi ye-alloy T: Ifanele ukubopha ngokuphambuka okuthile noma ama-substrates aqinile.

I-2.I-Titanium carbide impahla M: ubulukhuni obuphezulu, ukuqhutshwa komsebenzi oqinile, ukucindezela okuphansi (kunconywa ukuqala kusuka ku-7g ukuze kwandiswe).

I-3.Tungsten steel H:: ubulukhuni obuphezulu, ukuqhutshwa komsebenzi okuqinile, ukulungisa imingcele eduze ne-United States dewey1.

I-WEDGE groove

Isakhiwo se-WEDGE Arbor

WEDGES uchungechunge

AMASHIKELA OCINGO AMANCANE

Ilungele ukuhlanganisa izintambo zegolide, izintambo ze-aluminium nezinye izintambo ngaphakathi kwama-75um.

WEDGES ithebula likasayizi

I-TS	Ukuvuleka kwe-H	I-BL Bonding ubude	T Ubude bekhanda lethuluzi	W Ububanzi bekhanda lethuluzi	I-WirediaUbubanzi bentambo
iyunithi	eyodwa	eyodwa	eyodwa	eyodwa	eyodwa
1210	30	25	300	64	10-15 um
1510	38	25	343	64	13-18um
1515	38	38	356	64
1520	38	51	368	64
2015	51	38	368	102	18-25 um
2020	51	51	368	102
2025	51	64	381	102
2525	64	64	406	102	33 um
3025	76	64	432	127	38 um
3050	76	127	559	152	51 umm
3550	89	127	559	152	51 umm
Uma eminye imininingwane idingeka. Ungathintana nezindali zethu

AMA-WEDGE OMKHULU WEZINTAMBO

Ilungele ukubopha izintambo ze-aluminium nezinye izintambo ezingaphezu kuka-75um.

WEDGES ithebula likasayizi

I-TS	Ukuvuleka kwe-H	I-BL Bonding ubude	T Ubude bekhanda lethuluzi	W Ububanzi bekhanda lethuluzi	I-WirediaUbubanzi bentambo
iyunithi	eyodwa	eyodwa	eyodwa	eyodwa	eyodwa
4560	114	152	787	191	76
6008	152	203	864	254	102
7510	191	254	1041	318	127
0912	229	305	1245	381	152
01014	267	356	1372	445	178
01215	305	381	1422	508	203
01518	381	457	1626	635	254
1820	457	508	2032	762	305
2122	533	559	2083	889	356
2424	610	610	2362	1016	406
.. Sicela uxhumane nomnyango wethu wokuthengisa ukuze uthole osayizi abengeziwe

AMA-RIBHONI WEDGES

Ifanele ukubopha i-alloy tape, i-aluminium tape nolunye ucingo.

WEDGES ithebula likasayizi

Ububanzi beribhoni				Iribhoni eliwugqinsi
iyunithi (u m)		12.7 um		25.4um
50 um		A1		B1
75 um		A2		B2
100um		A3		B3
125 um		A4		B4
150 um		A5		B5
200um		A6		B6
250 um		A7		B7
300 um		A8		B8
.. Sicela uxhumane nomnyango wethu wokuthengisa ukuze uthole osayizi abengeziwe
I-TS+BL	FR Unyawo oluhamba phambili	BR Unyawo lomhlahlandlela wangemuva	TW ububanzi bembobo	Ukuphakama kwe-TW Hole	T Ubude bekhanda lethuluzi
A120	25 um	8 um	50 um	75 um	126 um
A220	25 um	8 um	65 um	75 um	126 um
B325	25 um	8 um	65 um	75 um	190um
B330	25 um	8 um	90 um	176um	190um
B350	25 um	8 um	100um	340 um	380 um
... Bonke osayizi abokubhekisela kuphela, imininingwane eyengeziwe ingaxhumana nabadayisi bethu

I-WEDGE Ukwenza kube ngokwakho

Okulandelayo kubonise izimo zezinkinga ezihlukahlukene ezingase zenzeke ngesikhathi sokubopha kanye nezixazululo zabo.

I-Bonding Wedge

I-Semiconductor Packaging Process Bonding Wedge

Uhlobo

Izinhlelo zokusebenza

Ukukhetha okubalulekile

I-WEDGE groove

Isakhiwo se-WEDGE Arbor

WEDGES uchungechunge

AMASHIKELA OCINGO AMANCANE

AMA-WEDGE OMKHULU WEZINTAMBO

AMA-RIBHONI WEDGES

I-WEDGE Ukwenza kube ngokwakho

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